Talos F200i

High-resolution (S)TEM for materials science; Dual-X EDS with wide pole piece; Automated, multi-user ready

• Status: Active
• Country: USA
• Electron gun type : Extreme FEG
• Standard detectors : Ceta 16M CMOS, HAADF, BF/DF STEM, IR, SmartCam
• Optional detectors : EDS (Bruker X-flash 30, 100, Dual-X); iDPC; Gatan EELS
• Cryo : Optional
• STEM : Yes
• STEM parameters: HAADF, BF/DF, iDPC; Panther; Dual-X
• Additional analytical capabilities (EDS/EDX ; EELS; SAED;NBD; others) : EDS, EELS, iDPC, tomography, APW, DCFI
• Electron optics : Constant-power X-TWIN objective lens; low-hysteresis design
• Resolution : TEM: ≤0.10 nm; STEM: ≤0.16 nm (XFEG), ≤0.14 nm (XCFEG)
• Optical column : Electron column with constant power lens and automated alignments
• Electron beam resolution : TEM line: ≤0.10 nm; STEM: ≤0.14 nm (X-CFEG)
• Accelerating voltage : 20 – 200 kV
• Image parameters : Ceta 16M: 4k–512 resolution, 1–320 fps (with enhancement)
• Camera details : Ceta 16M CMOS 4096×4096, bottom-mounted
• Stage parameters : Z travel ±0.375 mm; Tilt ±90° with tomography holder
• Holder Types : Tomography and in situ holders
• Cooling system : Cold trap standard; long-duration Dewar optional
• Vacuum system : Oil- and vibration-free airlock pumping
• Vibration, Magnetic, Noise tolerance : Drift Corrected Frame Integration (DCFI); low-hysteresis optics