Specifications

  • Category: Electron Microscopy
  • Technique: Transmission Electron Microscopy
  • Manufacturer: TESCAN
  • Country: Czechia
  • Available: Active
All specifications

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Short description

Near-UHV, analytical 4D-STEM with precession and real-time EDS mapping. Simplifies multimodal materials analysis

Specifications

Near-UHV, analytical 4D-STEM with precession and real-time EDS mapping. Simplifies multimodal materials analysis

  • Status: Active
  • Country: Czechia
  • Electron gun type : Schottky FEG
  • Standard detectors : Direct electron detector (QUADRO), dual EDS (window-less), BF/ADF/HAADF STEM
  • Optional detectors : Virtual STEM, strain, tomography, diffraction tomography (3DPED), PETS software
  • STEM : Yes
  • STEM parameters: Virtual STEM, analytical STEM with EDS at each pixel, tomographic modes
  • Additional analytical capabilities (EDS/EDX ; EELS; SAED;NBD; others) : 4D-STEM, EDS, orientation, strain, diffraction tomography, Virtual STEM
  • Electron optics : Inverted STEM column with precession diffraction, direct detection camera, and beam blanking
  • Resolution : STEM lattice: 2.8Å (BF), 3.5Å (HAADF); 4D-STEM enabled orientation/phase/strain maps
  • Optical column : 4D-STEM-specific with direct detector, PED, dual EDS, real-time beam alignment
  • Electron beam resolution : Atomic resolution (STEM); 1–3.5 nm dependent on mode
  • Accelerating voltage : 50 eV – 30 keV
  • Image parameters : Orientation/phase mapping, lattice imaging, diffraction, 4D-STEM datasets, tomography
  • Magnification : 1 gigapixel STEM images with 10 Mpix/s acquisition
  • Chamber : UHV, ConFlat flanges, copper gaskets, <10⁻⁶ Pa sample area
  • Camera details : Direct electron detector (QUADRO), 512×512 px, 2250 fps
  • Stage parameters : Motorized, precession and XY tilt with <1 nm beam diameter
  • Holder Types : STEM and diffraction, lamella and tomography prep
  • Sample size: Nano to submicron crystalline particles (STEM/Diffraction)
  • Aberration Correction type : Precession and integrated beam alignment reduce aberration
  • Vacuum system : Near UHV <10⁻⁶ Pa sample chamber

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TENSOR

  • Category: Electron Microscopy
  • Technique: Transmission Electron Microscopy
  • Manufacturer: TESCAN
  • Country: Czechia
  • Available: Active
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