Specifications

  • Category: Electron Microscopy
  • Technique: Scanning Electron Microscopy
  • Manufacturer: TESCAN
  • Country: Czechia
  • Available: Active
All specifications

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Short description

Field-free UHR-SEM and Ga FIB for high-precision microanalysis and sample prep

Specifications

Field-free UHR-SEM and Ga FIB for high-precision microanalysis and sample prep

  • Status: Active
  • Country: Czechia
  • Electron gun type : Schottky FEG
  • Standard detectors : In-column SE and BSE, Everhart-Thornley SE, chamber IR camera
  • Optional detectors : R-STEM, LE-BSE, Rainbow CL, TOF-SIMS, Raman, EBSD, WDS, EDS
  • Cryo : Optional
  • FIB: Yes
  • STEM : Yes
  • STEM parameters: BF, DF, HAADF sectors, holders for 8 grids
  • Additional analytical capabilities (EDS/EDX ; EELS; SAED;NBD; others) : EDS, EBSD, WDS, Raman, TOF-SIMS, 3D tomography, DrawBeam nanopatterning
  • Electron optics : BrightBeam UHR-SEM with electrostatic-magnetic lens, field-free optics
  • Resolution : 0.8 nm @ 30 keV STEM; 0.9 nm @ 15 keV SE; 1.3–1.5 nm @ 1 keV
  • Optical column : BrightBeam field-free with electromagnetic beam aperture control
  • Electron beam resolution : 0.8–1.5 nm depending on mode and voltage
  • Beam current : 2 pA – 400 nA
  • Accelerating voltage : 50 eV – 30 keV (<50 eV with BDM)
  • Image parameters : 16k × 16k, 8-channel, color mapping, live overlay, image stitching
  • Magnification : Max field of view: 7 mm @ WD = 6 mm; 50 mm @ max WD
  • Chamber : 340 mm W × 315 mm D, 20+ ports, active suspension
  • Camera details : Dual IR cameras (optional), plasma cleaner, up to 32” QHD monitor
  • Stage parameters : 5-axis compucentric; X/Y: 130 mm, Z: 90 mm, Tilt: –60° to +90°
  • Holder Types : STEM holders (up to 8 grids), lamella, mechanical tests, EBSD cradle
  • Sample size: Max height 90 mm (132 mm w/o rotation), large wafer extensions
  • Cooling system : Optional (water-cooled BSE detectors)
  • Vacuum system : High vacuum <9×10⁻³ Pa; low vacuum 7–500 Pa; all oil-free
  • Power Requirements and Consumption : 230 V ±10%, 50 Hz, 2300 VA, 2 kW UPS included
  • Environmental requirements : 17–24 °C, <65% RH, <10 µm/s vibration, <60 dBC, magnetic <300 nT
  • Vibration, Magnetic, Noise tolerance : <10 µm/s <30 Hz; <20 µm/s >30 Hz; <60 dBC; <300 nT sync field
  • Dimensions and Weight: Footprint: minimum 4.2 × 3.1 m; door width ≥1.0 m

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VEGA 3

  • Category: Electron Microscopy
  • Technique: Scanning Electron Microscopy
  • Manufacturer: TESCAN
  • Country: Czechia
  • Available: Active
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