Specifications

  • Category: Electron Microscopy
  • Technique: Scanning Electron Microscopy
  • Manufacturer: TESCAN
  • Country: Czechia
  • Available: Active
All specifications

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Short description

FIB-SEM platform for advanced nanofabrication. Combines UHR SEM imaging with Ga+ FIB and nanopatterning capabilities

Specifications

FIB-SEM platform for advanced nanofabrication. Combines UHR SEM imaging with Ga+ FIB and nanopatterning capabilities

  • Status: Active
  • Country: Czechia
  • Electron gun type : Schottky FEG
  • Standard detectors : In-Beam SE, In-Beam f-BSE, Mid-Angle BSE, Everhart-Thornley (ET)
  • Optional detectors : LE-BSE, R-BSE, Rainbow CL, STEM, EDS, EBSD, WDS, TOF-SIMS, Raman
  • Cryo : Optional
  • FIB: Yes
  • STEM : Yes
  • STEM parameters: BF, DF, HAADF; 8 grid holders; 0.5 nm resolution at 30 keV
  • Additional analytical capabilities (EDS/EDX ; EELS; SAED;NBD; others) : EDS, EBSD, WDS, TOF-SIMS, Raman, nanopatterning, 3D tomography
  • Electron optics : Triglav UHR column with TriLens (field-free, crossover-free, immersion modes)
  • Resolution : 0.6 nm at 15 keV, 0.9 nm at 1 keV, 0.5 nm at 30 keV (STEM)
  • Optical column : TriLens with field-free analytical and immersion modes
  • Electron beam resolution : 0.5–1.2 nm depending on energy and mode
  • Beam current : 2 pA – 400 nA
  • Accelerating voltage : 200 eV – 30 keV (<200 eV with BDM)
  • Image parameters : Max frame: 16k×16k, 8-channel, live overlay, color mapping
  • Magnification : Up to 16k×16k resolution with dynamic focus and image shift
  • Chamber : 340×315 mm; 20+ ports; IR camera; optional wafer extensions
  • Camera details : Dual IR cameras (1 standard, 1 optional)
  • Stage parameters : 5-axis compucentric: X/Y = 130 mm, Z = 90 mm, Tilt = –60° to +90°, Rotation = 360°
  • Holder Types : STEM grid holder (up to 8), cradle stage, EBSD cradle
  • Sample size: Up to 132 mm height without rotation; wafer cradle up to 12"
  • Aberration Correction type : TriLens crossover-free design reduces aberrations
  • Vacuum system : High vacuum <9×10⁻³ Pa; low vacuum 7–500 Pa; all oil-free
  • Power Requirements and Consumption : 230 V ±10%, 50 Hz, 2300 VA; includes UPS
  • Environmental requirements : Temp: 17–24 °C; RH <65%; vibration <10 µm/s <30 Hz; noise <60 dBC; magnetic <300 nT
  • Vibration, Magnetic, Noise tolerance : Vibration <10 µm/s at <30 Hz; magnetic field <300 nT synchronous
  • Dimensions and Weight: Min. installation room: 4.2 × 3.1 m; door width ≥1.0 m

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TENSOR

  • Category: Electron Microscopy
  • Technique: Transmission Electron Microscopy
  • Manufacturer: TESCAN
  • Country: Czechia
  • Available: Active
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