Specifications

  • Category: Electron Microscopy
  • Technique: Scanning Electron Microscopy
  • Manufacturer: TESCAN
  • Country: Czechia
  • Available: Active
All specifications

About

Short description

Plasma FIB-SEM platform for large cross-sectioning and high-resolution end-pointing in semiconductor failure analysis

Specifications

Plasma FIB-SEM platform for large cross-sectioning and high-resolution end-pointing in semiconductor failure analysis

  • Status: Active
  • Country: Czechia
  • Electron gun type : Schottky FEG
  • Standard detectors : In-Beam SE, f-BSE, Mid-Angle BSE, Everhart-Thornley (ET)
  • Optional detectors : TriSE, TriBE, STEM, EDS, EBSD, WDS, TOF-SIMS
  • FIB: Yes
  • STEM : Yes
  • STEM parameters: BF/DF/HAADF, lamella prep, live SEM monitoring during milling
  • Additional analytical capabilities (EDS/EDX ; EELS; SAED;NBD; others) : EDS, EBSD, WDS, TOF-SIMS, 3D EBSD/EDS tomography, endpoint detection, planar delayering
  • Electron optics : Triglav UHR SEM column with TriLens immersion optics
  • Resolution : 0.6 nm at 15 keV, 0.9 nm at 1 keV (BDM), 0.5 nm at 30 keV (STEM)
  • Optical column : TriLens with field-free and immersion SEM imaging
  • Electron beam resolution : 0.5–1.2 nm depending on energy and mode
  • Beam current : Up to 400 nA
  • Accelerating voltage : 50 eV – 30 keV
  • Image parameters : 16k×16k, 8-channel, live FIB-SEM acquisition, image stitching
  • Magnification : Up to 1 mm FOV; supports 3D reconstruction and tomography
  • Chamber : 340×315 mm; compatible with 6”, 8”, 12” wafers and Raman integration
  • Camera details : IR camera; dual live SEM view during milling
  • Stage parameters : 5-axis compucentric: X/Y = 130 mm, Z = 90 mm, Tilt = –60° to +90°, Rotation = 360°
  • Holder Types : Rocking Stage, lamella prep, STEM, EBSD cradles
  • Sample size: 1 mm-wide cross-sections; bulk structures and TSVs
  • Aberration Correction type : TriLens with immersion mode and crossover-free path
  • Vacuum system : High vacuum <9×10⁻³ Pa; low vacuum 7–500 Pa; all oil-free
  • Power Requirements and Consumption : 231 V ±10%, 50 Hz, 2300 VA; includes UPS
  • Environmental requirements : Temp: 17–24 °C; RH <65%; vibration <10 µm/s <30 Hz; noise <60 dBC; magnetic <300 nT
  • Vibration, Magnetic, Noise tolerance : Vibration <10 µm/s at <30 Hz; magnetic field <300 nT synchronous
  • Dimensions and Weight: Min. installation room: 4.2 × 3.1 m; door width ≥1.0 m

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TENSOR

  • Category: Electron Microscopy
  • Technique: Transmission Electron Microscopy
  • Manufacturer: TESCAN
  • Country: Czechia
  • Available: Active
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