Specifications

  • Category: Electron Microscopy
  • Technique: Scanning Electron Microscopy
  • Manufacturer: CIQTEK 
  • Country: China
  • Available: Active
All specifications

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Short description

Ultra-high-resolution FE-SEM with 0.6 nm resolution, dual deceleration, up to 208 mm wafers

Specifications

Ultra-high-resolution FE-SEM with 0.6 nm resolution, dual deceleration, up to 208 mm wafers

  • Status: Active
  • Country: China
  • Electron gun type : Schottky FEG
  • Standard detectors : In-lens detector, ETD
  • Optional detectors : BSED (retractable), STEM, EDS, EBSD, 4"/8" loadlock, anti-vibration platform
  • STEM : Optional
  • STEM parameters: Retractable; high-res 3D ion-STEM
  • Additional analytical capabilities (EDS/EDX ; EELS; SAED;NBD; others) : EDS, EBSD, 3D, loadlock plasma clean, AI denoise
  • Electron optics : SuperTunnel + dual deceleration, magnetic/electrostatic lens combo
  • Resolution : 0.6 nm @ 15 kV (SE), 1.0 nm @ 1 kV (SE)
  • Optical column : Dual deceleration column, SuperTunnel optics
  • Electron beam resolution : 0.6–1.0 nm depending on mode
  • Accelerating voltage : 0.02–30 kV
  • Image parameters : Auto focus, stitching, AI noise reduction, 3D recon
  • Magnification : 1× – 2,500,000×
  • Chamber : 16 ports; 4"/8" loadlock; stage X/Y=110 mm, Z=65 mm
  • Camera details : Dual cameras
  • Stage parameters : 5-axis mechanical eucentric: X/Y=110 mm, Z=65 mm
  • Holder Types : Up to 8” wafer, various holders
  • Sample size: Max Ø208 mm (8”)
  • Aberration Correction type : SuperTunnel + stage deceleration reduces aberrations
  • Cooling system : Water-cooled deceleration, optional enclosure
  • Vacuum system : Auto control, cleanroom-compatible
  • Environmental requirements : Magnetic field + acoustic enclosure optional
  • Vibration, Magnetic, Noise tolerance : Optional enclosure; SEMI certified

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DB550

  • Category: Electron Microscopy
  • Technique: Scanning Electron Microscopy
  • Manufacturer: CIQTEK 
  • Country: China
  • Available: Active
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