Helios 5 EXL

Wafer-scale FIB-SEM for 5 nm node and beyond; Machine-learning end-pointing; High-precision lamella prep

• Status: Active
• Country: USA
• Electron gun type : Schottky FEG
• Standard detectors : 30 kV STEM detector (BF/DF/HAADF); IR camera; EDS
• Optional detectors : Oxford EDS; STEM detector
• FIB: Yes
• STEM : Yes
• STEM parameters: BF/DF/HAADF segments, 30 kV STEM detector
• Additional analytical capabilities (EDS/EDX ; EELS; SAED;NBD; others) : Oxford EDS; STEM; CAD nav; iFast; FOUP loader
• Electron optics : Elstar UHR Column with UC+ monochromator
• Resolution : 1.0 nm at 15 kV; 0.9 nm at 1 kV
• Optical column : Elstar UHR Immersion Lens
• Electron beam resolution : 1.0 nm at 15 kV; 0.9 nm at 1 kV
• Accelerating voltage : SEM: 20 V – 30 kV; FIB: 500 V – 30 kV
• Chamber : Manual and automated 300 mm wafer handling
• Camera details : Optical microscope with 920 µm field of view
• Holder Types : TEM grid and wafer holders supported
• Sample size: 300 mm wafers (manual or automated)
• Environmental requirements : Fab-compatible (AFL option); FOUP loading