JSM-IT210

Tungsten SEM for high vacuum and low vacuum imaging. Supports embedded EDS for real-time analysis. Includes SMILE VIEW Lab for data management.

• Status: Active
• Country: Japan
• Electron gun type : Schottky FEG
• Standard detectors : SED, BED, EDS (60 mm²)
• Optional detectors : LHSED, SBED, VBED, TED, others
• Cryo : Optional
• Additional analytical capabilities (EDS/EDX ; EELS; SAED;NBD; others) : EDS, 3D imaging, particle analysis
• Electron optics : Fully automatic gun alignment
• Resolution : 3.0 nm (30 kV), 15.0 nm (1.0 kV); 4.0 nm (30 kV BED) in low vacuum
• Beam current : 1 pA to 1 μA
• Accelerating voltage : 0.3 to 30 kV
• Image parameters : 640×480 to 5120×3840 px
• Magnification : ×5 to ×300,000 (photo); ×15 to ×883,652 (display)
• Chamber : Multipurpose chamber
• Camera details : Optional chamber scope
• Stage parameters : Eucentric stage, X: 80 mm, Y: 40 mm, Z: 5–48 mm, Tilt: -10°–90°, Rotation: 360°
• Sample size: Max Ø150 mm, H: 53 mm
• Vacuum system : TMP ×1, RP ×1
• Power Requirements and Consumption : 100 V AC, 50/60 Hz, 1.5 kVA
• Environmental requirements : 20 ±5°C, 30–60% RH, ≤0.3 μT
• Vibration, Magnetic, Noise tolerance : ≤0.3 μT
• Dimensions and Weight: 630 × 840 × 1510 mm, 260 kg