Säntis 300

Full wafer CL-SEM tool for 150, 200, 300 mm wafers; simultaneous SEM imaging and optical acquisition; supports multiple scanning modes

• Status: Active
• Country: Switzerland
• Standard detectors : Panchromatic CL, hyperspectral CL, SE image detectors
• Additional analytical capabilities (EDS/EDX ; EELS; SAED;NBD; others) : CL intensity maps, hyperspectral emission spectrum per pixel, defect detection and classification
• Electron optics : Custom electron column with tightly integrated light optics; field of view up to 300 µm; ±1% light collection uniformity
• Resolution : Beam spot size: 0.5 to 2.5 µm
• Optical column : Fully aperture-matched light collection optics integrated with electron column
• Electron beam resolution : 0.5 – 2.5 µm spot size depending on mode
• Image parameters : Pixel time: down to 0.1 µs (monochromatic), 1 ms (hyperspectral); up to 4 wafers/hour @150 mm
• Chamber : Closed system with edge detection, wafer bow mapping, vacuum loadlock in P2 and P3 configs
• Camera details : SE camera with 0.1 µs pixel dwell time; automated analysis software
• Stage parameters : 300 mm wafer handling; auto alignment; system configurations P1–P3e (EFEM)
• Holder Types : 150, 200, 300 mm wafers; intermediary 300 mm susceptor for smaller samples
• Sample size: Up to 300 mm wafers
• Aberration Correction type : Fully optimized light and electron optics with matched aperture; ±1% uniformity across 300 µm FOV
• Cooling system : Dry nitrogen and compressed air supply required
• Vacuum system : System configurations: P1 (manual), P2 (manual + loadlock), P3c (cassette), P3e (EFEM)
• Power Requirements and Consumption : Power required; other facilities include dry N₂, air, exhaust, remote pump
• Environmental requirements : Dry nitrogen, compressed air, power, exhaust
• Dimensions and Weight: 2425 mm × 1300 mm × 2055 mm; ~2750 kg